Electrical interconnections
Presentation of the paper [B95]

[B95] F. Broydé, E. Clavelier, "Multiconductor Transmission Line Models for Modal Transmission Schemes", IEEE Trans. Components, Packaging and Manufacturing Technology, Vol. 3, No. 2, pp. 306-314, Feb. 2013.

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     The results of the paper [B95] have been later used by other authors and researchers, for instance in:

• L. Pizano-Escalante, O. Longoria-Gandara, R. Parra-Michel, J.L. Naredo, "Crosstalk Cancellation on High-Speed Interconnects Through a MIMO Linear Precoding", IEEE Trans. Microwave Theory Techn., Vol. 61, No. 11, pp. 3860-3871, Nov. 2013.
• M. Chernobryvko, D. De Zutter, D. Vande Ginste, "Nonuniform Multiconductor Transmission Line Analysis by a Two-Step Perturbation Technique", IEEE Trans. Components, Packaging and Manufacturing Technology, Vol. 4, No. 11, pp. 1838-1846, Nov. 2014.
• Z. Yan, K. Aygün, H. Braunisch, P.D. Franzon, "Multimode High-Density Link Design Methodology and Implementation", IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 6, No. 8, pp. 1251-1260, Aug. 2016.
• C. Sreerama, S.H. Hall, P.G. Huray, A.Z. Ramirez, M.W. Leddige, O.B. Oluwafemi, A.A. Aziz, J. Wight, "A Crosstalk-Friendly Signaling Method", IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 8, No. 9, pp. 1621-1631, Sept. 2018.