Electrical interconnections
Presentation of the paper [B98]

[B98] F. Broydé, E. Clavelier, J.E. Schutt-Ainé: "Some Internal Crosstalk Reduction Schemes", Proc. IEEE 22th Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2013, San Jose, pp. 227-230, Oct. 27-30, 2013.

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     The results of the paper [B98] have been later used by other authors and researchers, for instance in:

• Z. Yan, K. Aygün, H. Braunisch, P.D. Franzon, "Multimode High-Density Link Design Methodology and Implementation", IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 6, No. 8, pp. 1251-1260, Aug. 2016.
• C. Sreerama, S.H. Hall, P.G. Huray, A.Z. Ramirez, M.W. Leddige, O.B. Oluwafemi, A.A. Aziz, J. Wight, "A Crosstalk-Friendly Signaling Method", IEEE Trans. Compon., Packag. Manuf. Technol., Vol. 8, No. 9, pp. 1621-1631, Sept. 2018.